Henkel Loctite 406 Equivalent Surface Insensitive Instant Adhesive
from Tina(hengying@cnhybond.com 0086-18927302778 Skype:hengying11)
PRODUCT DESCRIPTION
HYBOND 406 IS designed for the assembly of difficult to bond materials which require uniform stress distribution and strong tension and/or shear strength. The product provides rapid bonding of a wide range of materials, including metals, plastics and elastomers, HYBOND406 is also suited for bonding porous materials such as woods, paper, leather and fabric.
PRODUCT CHARACTERISTICS
Technology: Cyanoacrylate
Chemical Type: Ethyl cyanoacrylate
Appearance (uncured): Transparent colorless liquid
Components: one part-require no mixing
Viscosity, Brookfield-LVF, 25℃1: 20-30cps
Spindle 1, speed 30 rpm
Cure: Humidity
Application: Bonding
Key substrates: Metals, plastics and rubber
Specific Gravity@25℃: 1.05
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the curing process. Although full functional strength is developed in a relatively short time, curing continues for at least 24 hours before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table below shows the fixture time achieved on different materials at 22 °C / 50 % relative humidity. This is defined as the time to develop a shear strength of 0.1 N/mm².
Fixture Time, seconds:
Steel 20 to 30
Aluminum 2 to 10
Zinc dichromate 10 to 29
Neoprene <5
Rubber, nitrile <5
ABS 1 to 2
PVC 3 to 10
Polycarbonate 5 to 11
Phenolic <2
Wood (balsa) <1
Wood (oak) 10 to 30
Wood (pine) 10 to 20
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond lines result in high cure speeds, increasing the bond gap will decrease the rate of cure.
Cure Speed vs. Humidity
The rate of cure will depend on the ambient relative humidity. Higher relative humidity levels result in more rapid speed of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps, applying activator to the surface will improve cure speed. However, this can reduce ultimate strength of the bond and herefore testing is recommended to confirm effect.
Directions for use:
1. Bond areas should be clean and free from grease. Clean all surfaces with a HYBOND cleaning solvent and allow to dry.
2. HYBOND Primer may be applied to the bond area. Avoid applying excess Primer. Allow the Primer to dry.
3. HYBOND Activator may be used if necessary. Apply the HYBOND Activator to one bond surface (do not apply activator to the primed surface where Primer is also used). Allow the Activator to dry
4. Apply adhesive to one of the bond surfaces (do not apply the adhesive to the activated surface). Do not use items like tissue or a brush to spread the adhesive. Assemble the parts within a few seconds. The parts should be accurately located, as the short fixture time leaves little opportunity for adjustment.
5. HYBOND Activator can be used to cure fillets of product outside the bond area. Spray or drop the activator on the excess product.
6. Bonds should be held fixed or clamped until adhesive has fixtured.
7. Product should be allowed to develop full strength before subjecting to any service loads (typically 24 to 72 hours after assembly, depending on bond gap, materials and ambient conditions).
Storage
Store product in the unopened container in a dry location， Storage information may be indicated on the product container labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than 8 °C can adversely affect product properties. Material removed from containers may be contaminated during use. Do not return product to the original container. Heng ying Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact us.
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