Loctite 496 Quality Super Bonder Instant Adhesive
from Tina(hengying@cnhybond.com 0086-18927302778 Skype:hengying11)
Product Description
HYBOND 496 is a general purpose cyanoacrylate instant adhesive. It is particularly suited to bonding of metal substrates
Product Characteristics
Technology
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Cyanoacrylate
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Chemical Type
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Ethyl cyanoacrylate
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Appearance (uncured)
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Transparent colorless liquid
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Components
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one part-require no mixing
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Viscosity,Brookfield-LVF,25℃1
Spindle 1, speed 30 rpm
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40-60cps
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Cure
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Humidity
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Application
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Bonding
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Key substrates
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Metals, plastics and Elastomers
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Specific Gravity@25℃:
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1.1
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Typical Curing Performance
Under normal conditions, the atmospheric moisture initiates the curing process. Although full functional strength is developed in a relatively short time, curing continues for at least 24 hours before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table below shows the fixture time achieved on different materials at 22 °C / 50 % relative humidity. This is defined as the time to develop shear strength of 0.1 N/mm².
Fixture Time, seconds:
Mild Steel (degreased)
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20 to 40
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Aluminum
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30 to 60
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Zinc dichromate
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30 to 60
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Neoprene
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<10
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Rubber, nitrile
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<10
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ABS
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10 to 30
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PVC
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30 to 70
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Polycarbonate
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20 to 70
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Phenolic
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10 to 30
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Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond lines result in high cure speeds, increasing the bond gap will decrease the rate of cure.
Cure Speed vs. Humidity
The rate of cure will depend on the ambient relative humidity. Higher relative humidity levels result in more rapid speed of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps, applying activator to the surface will improve cure speed. However, it can reduce ultimate strength of the bond effect.
Directions for use:
(1). Bond areas should be clean and free from grease. Clean all surfaces with a HYBOND cleaning solvent and allow to be dried.
(2). HYBOND Primer may be applied to the bond area. Avoid applying excess Primer. Allow the Primer to dry.
(3). HYBOND Activator may be used if necessary. Apply HYBOND Activator to one bond surface (do not apply activator to the primed surface where Primer is also used). Allow the Activator to dry
(4). Apply adhesive to one of the bond surfaces (do not apply the adhesive to the activated surface). Do not use items like tissue or a brush to spread the adhesive. Assemble the parts within a few seconds. The parts should be accurately located, as the short fixture time leaves little opportunity for adjustment.
(5). HYBOND Activator can be used to cure fillets of product outside the bond area. Spray or drop the activator on the excess product.
(6). Bonds should be held fixed or clamped until adhesive has fixtured.
(7). Product should be allowed to develop full strength before subjecting to any service loads (typically 24 to 72 hours after assembly, depending on bond gap, materials and ambient conditions).
Storage
Store product in the unopened container in a dry location, storage instruction is shown on the label of bottle
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than 8 °C can adversely affect product properties. Material removed from containers may be contaminated during use. Do not return product to the original container. Heng ying Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact us.
Note
The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of person against any hazards that may be involved in the handling and then use. In light of the foregoing, HENG YING Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of HENG YING Corporation’s products. HENG YING Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any HENG YING Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide.
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